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| 001 | itec_10991 | ||
| 003 | DLC | ||
| 008 | ///////////////cc //////////////////itec// | ||
| 020 | _a0071363270 | ||
| 035 | 0 | 0 | _a10991 |
| 050 | _aTK7874 L3661m | ||
| 100 | 0 | _aLAU, JOHN H. / LEE | |
| 245 | 1 | 0 | _aMICROVIAS:FOR LOW COST, HIGH DENSITY INTERCONNECTS |
| 250 | _a1 | ||
| 260 |
_aU.S.A _bMcGRAW-HILL |
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| 300 | _a565 P. | ||
| 504 | _aINCLUYE INDICE | ||
| 650 | _a1.- FLEXURAL 2.- COEFFICIENT OF THERMAL EXPANSIONÌ | ||
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_2lcc _cBK |
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