MICROVIAS:FOR LOW COST, HIGH DENSITY INTERCONNECTS
LAU, JOHN H. / LEE
MICROVIAS:FOR LOW COST, HIGH DENSITY INTERCONNECTS - 1 - U.S.A McGRAW-HILL - 565 P.
INCLUYE INDICE
0071363270
1.- FLEXURAL 2.- COEFFICIENT OF THERMAL EXPANSIONÌ
TK7874 L3661m
MICROVIAS:FOR LOW COST, HIGH DENSITY INTERCONNECTS - 1 - U.S.A McGRAW-HILL - 565 P.
INCLUYE INDICE
0071363270
1.- FLEXURAL 2.- COEFFICIENT OF THERMAL EXPANSIONÌ
TK7874 L3661m